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Microchannel Heat Sink
Fabrication and Liquid Cooling System for High Heat Flux Integrated Circuits
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In this thesis, analytical, CFD and some experimental studies of microchannel heat sink (MHS) were performed. This thesis develops a closed-loop single-phase microchannel cooling system using de- ionized water as a coolant fluid for high heat flux integrated circuits. The design, fabrication and closed-loop system using MHS, pump, filter and heat exchanger is summarized. A Ni-Cr wire heat source is fabricated as a heater. A copper heat exchanger is designed to dissipate heat from the heated fluid coming out of the MHS. Some experiments were performed in the fabrication of microchannels on a (110) wafer. After the fabrication, MHS was bonded with BOROFLOAT® Glass. The parameters in this study include variable flow rates of coolant and power densities of heat source with uniform wall thickness and channel width of the microchannel heat sink.
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