Envío gratis a partir de 69,99 euros.

«Comprobar estado del pedido»

Entre a formar parte de una comunidad de amantes de los libros del mundo entero y acceda a un sinfín de ventajas. Crear una cuenta gratis

Envío gratuito con Zásilkovna para compras superiores a 59.99 €

Mensajería SEUR 4.99 € Mensajería GLS 7.99 € Mensajería Correos 5.49 € Mensajería DHL 5.49 € Punto SEUR 3.99 €

Contacto

Cómo comprar

Ayuda

Mi cuenta

▸ Vacío :-(

Envío gratis a partir de 69,99 euros.

RF/Microwave Hybrids

Name: RF/Microwave Hybrids
Brand: Springer-Verlag New York Inc.
SKU: 01423620
Price: 169.09 EUR
Availability: InStock
Author: Richard Brown
ISBN: 9781441953131

Basics, Materials and Processes

Richard Brown

Idioma

Inglés

Libro Tapa blanda

Código Libristo: 01423620

Editores Springer-Verlag New York Inc., diciembre 2010

RF/Microwave Hybrids is directed to acquaint technical managers, engineers and technicians, either w... Descripción completa

Código Libristo: 01423620

414 b

169.09 €

Almacenamiento externo Envío en 5-8 días

Hasta 30 días para devoluciones

Clientes que también han comprado

Technika využití energie větru Horst Crome

Tapa blanda

7.59 €

Patristik und Resilienz Clemens Sedmak

Tapa dura

143.89 €

Theorie und Methode in der Rechtswissenschaft Günther Winkler

Tapa blanda

41.79 €

Memoires d'Un Prefet de Police (Ed.1885) Leon Bienvenu

Tapa blanda

28.19 €

Geile Milfs: Die komplette Serie Aphrodite Press

Tapa blanda

20.09 €

RF/Microwave Hybrids is directed to acquaint technical managers, engineers and technicians, either with experience, or just entering the field, with the capabilities and limitations of the materials and processes used for fabricating high frequency circuits. It is essentially introductory in nature. Where possible, equations have been kept simple and to a minimum.§This text begins with an introduction to hybrid technology and basic high frequency principles. Following these, the major forms of transmission waveguide are discussed, and then current flow and loss considerations. Substrates, thick and thin film deposition, polymers, artwork, masks, photolithography, subtractive, additive and semi-additive methods, electro- and electroless plating and etching are covered. Passive and transmission line components are then treated within the confines of process requirements. With this background established, the text is directed toward the effects of processing and materials on passive and transmission line-based components. Packaging is discussed with emphasis on inductance considerations.